ASUS ProArt StudioBook W730G5T-H8094R RAM upgrade specifications
ASUS ProArt StudioBook Pro X W730G5T-H8094R specifications include DDR4-SDRAM memory upgrade capability across 4 SO-DIMM slots, supporting maximum capacity of 128 GB RAM. Compatible memory operates at 2666 MHz frequency. The workstation features SO-DIMM form factor slots enabling modular memory expansion for enhanced multitasking and professional applications performance.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 4x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2666 MHz |
| Maximum RAM | 128 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2666 (PC4-21328) |
| Bandwidth | 21.3 GB/s |
| Laptop Release date | 07 January 2020 |
Additional Notes
- The presence of 4 SO-DIMM slots implies a quad-channel memory architecture which significantly increases memory bandwidth for rendering tasks compared to standard dual-channel systems.
- Utilizing all 4 slots to reach the 128 GB maximum capacity requires high-density 32 GB modules but may result in a slight increase in latency due to the strain on the integrated memory controller.
- The ASUS ProArt StudioBook W730G5T-H8094R architecture necessitates identical module matching across all banks to maintain system stability and prevent downclocking below the 2666 MHz rated frequency.
- Physical access to secondary memory slots often requires the removal of the primary keyboard assembly or heat shielding which mandates specialized tools to avoid chassis damage.
- Mixing modules with different CAS latencies will force the motherboard to operate at the slowest common timing which reduces overall data throughput.
- Installation of memory modules exceeding the 2666 MHz specification will not result in performance gains as the chipset logic locks the bus speed to the established hardware limit.
- Thermal dissipation requirements increase proportionally with the installation of 4 high-capacity modules which may impact internal ambient temperatures during sustained workloads.