ASUS ROG G513IH-HN026T-BE RAM upgrade specifications

ASUS ROG Strix G15 G513IH-HN026T-BE laptop features DDR4-SDRAM memory with 2x SO-DIMM slots supporting maximum RAM capacity of 32 GB. Memory upgrade specifications include 3200 MHz frequency operation with SO-DIMM form factor. Compatible memory modules for this gaming laptop model enable expansion from factory configuration to maximum 32 GB total capacity.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date21 January 2021

Additional Notes

  • The ASUS ROG G513IH-HN026T-BE requires SO-DIMM modules rather than standard desktop DIMM, restricting compatibility to laptop-specific memory kits.
  • DDR4-3200 represents the maximum supported frequency, meaning higher-speed modules rated at 3600 MHz or 4000 MHz will downclock to 3200 MHz without performance gain.
  • The 32 GB ceiling enforces a practical configuration of 2x 16 GB modules for maximum capacity, as single 32 GB SO-DIMM modules would exceed the controller's addressing capability.
  • Dual SO-DIMM architecture enables symmetric dual-channel operation when identical modules populate both slots, doubling memory bandwidth compared to single-channel configurations.
  • Installing non-matching modules with different speeds or timings forces the memory controller to operate at the lowest common denominator, potentially reducing overall system performance.
  • SO-DIMM replacement typically preserves manufacturer warranty since memory slots use accessible retention clips rather than soldered components.
  • DDR4 voltage specification of 1.2V applies, meaning lower-voltage LPDDR4X modules lack physical and electrical compatibility with this socket type.
  • Single-module operation in either slot defaults to single-channel mode, halving available memory bandwidth and potentially creating bottlenecks in GPU-intensive workloads.
  • Non-ECC unbuffered SO-DIMM modules match this consumer-grade platform, while ECC or registered memory types introduce incompatibility with the system controller.
  • CAS latency variations among DDR4-3200 modules affect real-world access times, with CL22 modules delivering slower response than CL20 alternatives despite identical frequency ratings.