ASUS ROG G815LR-S9109W RAM upgrade specifications

ASUS G815LR-S9109W ASUS G815LR-S9109W ASUS G815LR-S9109W ASUS G815LR-S9109W ASUS G815LR-S9109W

The ASUS ROG Strix G18 G815LR-S9109W laptop features DDR5-SDRAM memory upgrade capabilities with 2x SO-DIMM slots supporting a maximum RAM capacity of 64 GB. Memory specifications include DDR5 technology operating at 5600 MHz frequency. Compatible RAM modules utilize SO-DIMM form factor, enabling users to expand memory capacity for enhanced system performance. Upgrade options accommodate both single and dual-channel memory configurations within the specified slot capacity and maximum memory threshold.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR5-SDRAM
Frequency5600 MHz
Maximum RAM64 GB
Voltage1.1V
Number of pins262-pin
InterfacePC5
PC Speed RatingPC5-5600 (PC5-44800)
Bandwidth44.8 GB/s
Laptop Release date20 January 2025

Additional Notes

  • The ASUS ROG G815LR-S9109W implements DDR5 technology, which operates at lower voltage (1.1V) than DDR4 (1.2V), resulting in reduced thermal output during sustained workloads but requiring platform-specific modules incompatible with DDR4 slots.
  • DDR5-5600 represents the baseline JEDEC standard speed for this generation, meaning modules rated for higher frequencies such as 6000 or 6400 MT/s will function but may default to 5600 unless XMP/EXPO profiles are supported and enabled in BIOS.
  • The dual SO-DIMM configuration limits upgrade flexibility to either replacing both modules simultaneously for capacity increases or operating in single-channel mode with one slot populated, which halves memory bandwidth and impacts integrated graphics performance.
  • Achieving the 64 GB ceiling requires two 32 GB SO-DIMM modules, a configuration that may encounter stability issues with certain motherboard revisions if modules lack proper power management integrated circuits or use non-standard die densities.
  • SO-DIMM DDR5 modules exhibit tighter physical clearance requirements than desktop DIMMs, with height restrictions typically under 30 mm to accommodate chassis limitations and thermal solutions in mobile platforms.
  • Memory frequency stability at 5600 MT/s depends on the memory controller's quality and thermal conditions, as DDR5 incorporates on-module voltage regulation that can throttle performance when operating temperatures exceed manufacturer-specified thresholds around 85°C.
  • Mixing modules with different capacities across the 2 slots will force the system into asymmetric or flex mode, maintaining dual-channel operation only for the capacity matched across both slots while reverting to single-channel for the excess capacity.
  • Factory-installed modules typically use JEDEC timings rather than performance-optimized XMP profiles, meaning aftermarket replacements with identical frequency specifications may exhibit different latency characteristics affecting application responsiveness.
  • Warranty preservation requires adherence to the maximum supported capacity and voltage specifications, as DDR5 modules rated above 1.1V nominal (often labeled as overclocking RAM) may void coverage if system instability results from their installation.
  • The absence of ECC support in standard consumer DDR5 SO-DIMMs means bit errors during transmission remain undetected and uncorrected, a consideration for workloads involving extended computational tasks or large dataset processing.