MSI Gaming GF76 11UE-036 Katana RAM upgrade specifications
The MSI GF76 11UE-036 Katana Gaming series laptop features DDR4-SDRAM memory upgrades across two SO-DIMM slots. Maximum memory capacity reaches 64 GB total, supporting DDR4 modules at 3200 MHz frequency. Memory form factor specifications utilize SO-DIMM configuration for this compatible upgrade option. Existing memory modules can be replaced or expanded within slot availability constraints to meet increased RAM requirements for gaming performance demands.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 22 July 2021 |
Additional Notes
- The MSI GF76 11UE-036 Katana contains 2 SO-DIMM slots operating as a dual-channel configuration, which means both slots must be populated for optimal memory bandwidth during gaming and content creation workloads.
- DDR4-3200 modules are standard for 11th-generation Intel platforms; however, memory speed scaling on this chipset plateaus beyond 3200 MHz, making higher-frequency kits (3600 MHz or above) provide negligible performance gains while consuming additional power.
- The 64 GB capacity ceiling restricts this platform to a maximum 32 GB per slot configuration, effectively capping single-stick upgrades and limiting future expansion beyond the dual-slot architecture.
- SO-DIMM compatibility is exclusive to laptop form factors; desktop DDR4 UDIMM modules are physically incompatible with this chassis, requiring laptop-grade replacement parts for warranty-safe upgrades.
- Removing existing memory to upgrade capacity will break any existing dual-channel symmetry if the original configuration uses mismatched capacities or speeds, potentially degrading performance relative to balanced module pairing.
- Memory replacement on this model does not typically void manufacturer warranty when performed correctly, though thermal compound disturbance during bottom-panel access may affect CPU cooler efficacy if disturbed during the upgrade procedure.