MSI Modern 14 B11SB-289 RAM upgrade specifications

MSI Modern 14 B11SB-289 laptop memory upgrade specifications include DDR4-SDRAM compatible with 1x SO-DIMM slot configuration. Maximum RAM capacity reaches 32 GB total, with supported frequency of 3200 MHz. Memory form factor utilizes SO-DIMM standard. Upgrade specifications indicate compatible DDR4 modules for expanding system memory beyond factory configuration.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date11 February 2021

Additional Notes

  • The single SO-DIMM slot architecture prevents dual-channel memory configuration, limiting bandwidth to approximately 25.6 GB/s instead of the 51.2 GB/s achievable with paired modules.
  • Applications that rely heavily on memory bandwidth, such as video editing or 3D rendering, may experience reduced throughput compared to dual-slot configurations.
  • Memory capacity upgrades require complete module replacement rather than incremental expansion, as no secondary slot exists for adding a second module alongside existing memory.
  • The 3200 MHz specification represents JEDEC standard DDR4-3200 operation, requiring compatible memory modules rated at PC4-25600 to function at full speed.
  • Intel 11th generation platforms typically support DDR4 voltages at 1.2V, making high-voltage overclocking modules incompatible with this system's power delivery specifications.
  • The 32 GB maximum capacity constraint reflects chipset addressing limitations, meaning denser modules exceeding this threshold will not be recognized even if physically compatible.
  • Non-ECC unbuffered SO-DIMM modules are required, as the MSI Modern 14 B11SB-289 consumer platform lacks support for error-correcting or registered memory architectures.
  • CAS latency timings between CL19 and CL22 are standard for DDR4-3200 SO-DIMM modules, with tighter timings offering marginal real-world performance gains in typical usage scenarios.
  • Module height restrictions in ultraportable chassis designs may necessitate single-sided memory configurations to prevent physical interference with internal components or thermal solutions.
  • User-accessible memory compartments in this model series typically allow RAM replacement without voiding manufacturer warranties, unlike soldered configurations that permanently fix capacity.