MSI Prestige PS42 8M Modern RAM upgrade specifications

MSI PS42 8M Modern MSI PS42 8M Modern MSI PS42 8M Modern MSI PS42 8M Modern MSI PS42 8M Modern

MSI Prestige PS42 8M Modern laptop features one SO-DIMM memory slot supporting DDR4-SDRAM modules. Maximum RAM capacity reaches 16 GB with DDR4-2400 MHz frequency specifications. RAM upgrade compatibility requires SO-DIMM form factor modules. Memory specifications indicate single-slot configuration limiting expansion options for this MSI PS series model.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM16 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date25 May 2019

Additional Notes

  • The MSI Prestige PS42 8M Modern features soldered memory in addition to the single SO-DIMM slot, meaning partial system RAM cannot be replaced or removed.
  • The 2400 MHz frequency limitation applies to both the soldered memory and any installed SO-DIMM module, preventing faster DDR4 speeds from running at their rated specifications.
  • Accessing the SO-DIMM slot requires complete bottom panel removal, which involves disconnecting the battery connector to prevent electrical damage during installation.
  • The 16 GB maximum capacity reflects a dual-channel configuration where the soldered memory is paired with the SO-DIMM module, typically as 8 GB soldered plus 8 GB user-installable.
  • Installing mismatched capacity modules will force the system into asymmetric dual-channel mode, potentially reducing memory bandwidth in certain workloads.
  • DDR4-2666 or DDR4-3200 modules will function but downclock to 2400 MHz, offering no performance advantage over native 2400 MHz modules.
  • The SO-DIMM slot operates at 1.2V standard for DDR4, making low-voltage DDR4L modules unnecessary and potentially incompatible with voltage requirements.
  • Single-rank versus dual-rank module architecture affects compatibility with the soldered memory configuration, requiring matched rank organization for optimal stability.
  • Thermal constraints in the slim chassis design may cause memory throttling under sustained high-bandwidth operations despite operating within specification.
  • Non-ECC unbuffered modules are required, as the mobile platform does not support error-correcting code memory or registered configurations.