ACER Aspire A515-45-R2J4 RAM upgrade specifications
The ACER Aspire 5 Series A515-45-R2J4 laptop supports DDR4-SDRAM memory upgrade specifications. The device features one SO-DIMM slot for RAM expansion, with maximum memory capacity of 24 GB. Compatible RAM modules operate at 2133 MHz frequency. The upgrade configuration includes on-board memory combined with the SO-DIMM slot, enabling users to expand the system's total memory capacity. These specifications detail the compatible memory types and maximum upgrade potential for the A515-45-R2J4 model.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 1x SO-DIMM |
| Form factor | On-board + SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2133 MHz |
| Maximum RAM | 24 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2133 (PC4-17064) |
| Bandwidth | 17.1 GB/s |
| Laptop Release date | 04 March 2021 |
Additional Notes
- The presence of on board memory indicates that a portion of the system RAM is permanently soldered to the motherboard and cannot be replaced or upgraded.
- The ACER Aspire A515-45-R2J4 utilizes a single expansion slot which limits memory configurations to a single channel upgrade path for the secondary module.
- Total capacity reaching 24 GB implies an asymmetric dual channel configuration where only the capacity matching the soldered chip operates at peak synchronous bandwidth.
- Installing a module with higher clock speeds will result in an automatic downclock to match the 2133 MHz limitation of the existing soldered memory or the system bus.
- Thermal constraints within the slim chassis may cause minor throttling during sustained high memory load due to the proximity of soldered memory chips to other core components.
- Physical access to the SO-DIMM slot requires the removal of the entire base panel which may involve piercing factory seals depending on regional service policies.
- Density limitations on the single available slot mean that 16 GB is the maximum verifiable module size compatible with the internal logic of the motherboard.
- Mixing different memory ranks between the soldered silicon and the removable SO-DIMM can lead to increased sub-timing latencies and reduced stability.