ACER Aspire A515-57-763M RAM upgrade specifications

ACER A515-57-763M ACER A515-57-763M ACER A515-57-763M ACER A515-57-763M ACER A515-57-763M

The Acer Aspire 5 Series A515-57-763M laptop features two SO-DIMM slots for DDR4-SDRAM memory upgrades. The system supports maximum RAM capacity of 32 GB total, with compatible modules operating at 3200 MHz frequency. Specifications indicate memory upgrade capability through dual SO-DIMM slots, allowing for flexible RAM configuration and expansion options on this Acer Aspire 5 model.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date26 January 2023

Additional Notes

  • The ACER Aspire A515-57-763M platform enforces a 32 GB total memory ceiling, limiting each SO-DIMM slot to a maximum 16 GB module regardless of higher-capacity module availability in the market.
  • DDR4-3200 represents the native speed specification, though actual operating frequency depends on CPU memory controller support and may downclock if mismatched modules are installed.
  • Dual SO-DIMM configuration enables dual-channel operation when matched module pairs are installed, potentially doubling memory bandwidth compared to single-channel configurations.
  • Mixing modules with different speeds forces all installed memory to operate at the speed of the slowest module, creating a performance bottleneck.
  • Mixing modules with different capacities while maintaining dual-channel mode requires specific slot population rules, typically placing the higher-capacity module in the primary channel.
  • Non-identical module pairs may force the system into flex mode or asymmetric dual-channel, reducing effective bandwidth compared to perfectly matched configurations.
  • SO-DIMM form factor installation typically requires partial disassembly of the bottom chassis panel, with potential warranty implications if manufacturer seals are broken during access.
  • Voltage compatibility matters as DDR4 modules operate at 1.2V standard, and mixing standard voltage with low-voltage variants can cause boot failures or instability.
  • CAS latency differences between modules, even at identical frequencies, can trigger conservative timing fallback that reduces overall memory subsystem responsiveness.
  • Upgrading from single-rank to dual-rank modules at maximum capacity may stress the memory controller, potentially requiring BIOS-level timing adjustments for stability.
  • Temperature constraints within the laptop chassis may limit sustained performance of high-density memory configurations during extended workloads.