ACER Extensa EX215-31-C46G RAM upgrade specifications

ACER EX215-31-C46G ACER EX215-31-C46G ACER EX215-31-C46G ACER EX215-31-C46G ACER EX215-31-C46G

The ACER Extensa 15 Series EX215-31-C46G laptop features DDR4-SDRAM memory specifications with a maximum RAM capacity of 8 GB. The system contains one SO-DIMM upgrade slot available for memory expansion, operating at 2400 MHz frequency. Compatible memory upgrades support DDR4 technology. The machine includes on-board memory integrated with the removable SO-DIMM slot configuration, allowing users to expand total system memory through the single available upgrade slot.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM8 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date10 April 2021

Additional Notes

  • The presence of a single SO-DIMM slot alongside on-board memory indicates that dual-channel memory architecture is limited to the capacity of the soldered chip.
  • The ACER Extensa EX215-31-C46G achieves its maximum capacity by replacing the existing module in the lone expansion slot, as the total addressable memory is capped by the motherboard chipset.
  • Installing a module with a frequency higher than 2400 MHz will result in automatic downclocking to match the system bus speed, preventing any realized performance gains from faster memory kits.
  • Memory upgrades require matching the voltage specifications of the soldered on-board RAM to ensure system stability and prevent boot failures.
  • Structural limitations of the single-slot design mean that increasing memory requires discarding the current removable module rather than adding to it.
  • Latency timings will default to the highest common denominator between the integrated memory and the added SO-DIMM, potentially bottlenecking integrated graphics performance.
  • The ultra-low power consumption profile of the hardware suggests that high-density modules may face power delivery constraints if they exceed standard DDR4 voltage tiers.