ACER Nitro AN515-56-795N RAM upgrade specifications

ACER Nitro 5 series model AN515-56-795N features DDR4-SDRAM memory with 2x SO-DIMM slots for RAM upgrade capacity. Maximum supported memory reaches 32 GB total, with compatible modules operating at 3200 MHz frequency. The SO-DIMM form factor specifications enable memory expansion on this gaming laptop model. Upgrade compatibility requires DDR4-SDRAM modules meeting the 3200 MHz frequency and SO-DIMM slot requirements for optimal performance with the AN515-56-795N.

Additional Notes

• The ACER Nitro AN515-56-795N supports dual-channel memory architecture through its 2 SO-DIMM slots, enabling doubled theoretical bandwidth compared to single-channel configurations when populated with matching modules.
• Systems limited to 32 GB total capacity require individual modules not exceeding 16 GB density to reach maximum supported memory.
• DDR4-3200 represents a native JEDEC standard specification, eliminating the need for XMP profile activation or BIOS configuration changes typically associated with overclocked memory kits.
• SO-DIMM form factor modules measure 67.6 mm in length versus 133.35 mm for standard desktop DIMMs, creating physical incompatibility with desktop memory despite identical DDR4 technology.
• Operating voltage for DDR4-SDRAM modules standardizes at 1.2V, reducing power consumption by approximately 20% compared to DDR3's 1.5V requirement.
• Mixing modules with different rated frequencies forces the memory controller to operate all modules at the slowest installed speed, potentially degrading performance if mismatched.
• CAS latency specifications typically range from CL19 to CL22 at 3200 MHz frequency, with absolute latency in nanoseconds remaining relatively constant across different CL ratings at this speed.
• Non-ECC unbuffered modules remain the standard for consumer laptop platforms, as registered or ECC memory types create incompatibility with mainstream mobile chipsets.
• Accessing SO-DIMM slots in gaming laptops frequently requires complete bottom panel removal rather than dedicated access doors, necessitating thermal paste reapplication if cooling assembly detachment occurs.
• Warranty preservation depends on avoiding physical damage to retention clips or contact pins during module installation, as user-accessible components typically maintain coverage under most manufacturer policies.
• Single-rank versus dual-rank module architecture affects memory interleaving capabilities, with dual-rank configurations sometimes providing marginal performance advantages in bandwidth-sensitive applications.
• Temperature sensors integrated into SO-DIMM modules enable thermal throttling at approximately 85°C junction temperature, protecting data integrity during sustained high-memory workloads.