ASUS ROG GV601RM-114W RAM upgrade specifications
ASUS ROG Flow X16 model GV601RM-114W supports DDR5-SDRAM memory upgrades through two SO-DIMM slots. The laptop specifications indicate maximum RAM capacity of 64 GB, compatible with DDR5 modules operating at 4800 MHz frequency. Memory upgrade options allow for configurations ranging from standard to maximum capacity, with SO-DIMM form factor compatibility required for all compatible upgrades.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR5-SDRAM |
| Frequency | 4800 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.1V |
| Number of pins | 262-pin |
| Interface | PC5 |
| PC Speed Rating | PC5-4800 (PC5-38400) |
| Bandwidth | 38.4 GB/s |
| Laptop Release date | 05 October 2022 |
Additional Notes
- The ASUS ROG GV601RM-114W utilizes DDR5-4800 modules, which operate at significantly lower voltage (1.1V) compared to DDR4 counterparts, reducing thermal output during extended gaming sessions or intensive workloads.
- DDR5 architecture implements on-die ECC (Error Correction Code) at the DRAM level, providing enhanced data integrity without requiring system-level ECC support from the motherboard.
- The 4800 MHz base frequency represents the entry-level speed tier for DDR5, meaning aftermarket modules rated at 5200 MHz or higher may offer measurable performance gains in memory-intensive applications without compatibility issues.
- SO-DIMM DDR5 modules incorporate dual-channel operation on each individual module through internal bank grouping, effectively creating quad-channel bandwidth even with 2 populated slots.
- The 64 GB maximum capacity limitation stems from chipset addressing constraints rather than physical slot limitations, requiring two 32 GB modules for full capacity utilization.
- Mixed-capacity configurations (such as 16 GB paired with 32 GB) will function but may prevent optimal interleaving, potentially reducing memory bandwidth by forcing asymmetric channel operation.
- DDR5's higher burst length (16n vs DDR4's 8n) increases minimum transfer size, which can introduce latency penalties in applications with small, random memory access patterns.
- The SO-DIMM form factor limits heat spreader dimensions, making passive cooling less effective on high-frequency modules compared to desktop DIMM equivalents with larger surface area.
- JEDEC-standard DDR5-4800 modules will operate with SPD (Serial Presence Detect) timings automatically, while XMP 3.0 or EXPO profiles require BIOS support that may vary across firmware versions.
- Upgrading from single-channel (1 module) to dual-channel (2 modules) configuration typically yields 40-60% bandwidth improvement in integrated graphics scenarios, though discrete GPU systems see smaller gains.
- DDR5 command/address bus architecture introduces higher baseline latency (CAS latency around CL40 at 4800 MHz) compared to DDR4, which may affect latency-sensitive applications despite higher bandwidth.
- Accessing the SO-DIMM slots on most ROG gaming laptops requires bottom panel removal, which typically involves multiple screw types and potential warranty seal disruption depending on regional service policies.