ASUS ROG G513QM-HF026 RAM upgrade specifications
ASUS ROG Strix G15 model G513QM-HF026 features two SO-DIMM slots supporting DDR4-SDRAM memory upgrades. The laptop specifications indicate maximum RAM capacity of 32 GB total, with compatible memory operating at 3200 MHz frequency. Memory upgrade slots accommodate standard SO-DIMM form factor modules, enabling users to expand system RAM from factory configuration up to specified maximum capacity limits.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 26 January 2021 |
Additional Notes
- The dual-channel architecture requires identical module pairs to ensure maximum memory bandwidth and prevent system-wide latency spikes.
- Upgrading the ASUS ROG G513QM-HF026 necessitates the complete replacement of existing modules because both available slots are occupied in the standard pre-configured high-performance setups.
- The processor integrated memory controller imposes a hard cap on frequency, meaning modules with higher speeds will downclock to 3200 MHz automatically.
- Physical installation requires a non-conductive pry tool to release the internal plastic clips and a specific screwdriver for the underside chassis screws to avoid strip damage.
- Users must verify that replacement RAM utilizes a 1.2V profile to maintain compatibility with the motherboard power delivery system without requiring manual BIOS voltage adjustments.
- Replacing factory components does not void the hardware warranty provided the internal anti-static precautions are followed and no physical damage occurs to the surrounding SMD components during the swap.
- Density limitations of the chipset restrict individual slot capacity to 16 GB per module to reach the verified total threshold.
- Heat dissipation within the compact SODIMM area benefits from modules without thick decorative heat spreaders to maintain sufficient clearance between the board and the bottom panel.