ASUS ROG G513QM-HN185T RAM upgrade specifications
The ASUS ROG Strix G15 G513QM-HN185T features DDR4-SDRAM memory upgrade capabilities with two SO-DIMM slots supporting a maximum RAM capacity of 32 GB. Compatible memory modules operate at 3200 MHz frequency specifications. The laptop's memory configuration allows for flexible upgrades utilizing standard SO-DIMM form factor modules. These RAM upgrade specifications enable users to expand the system's memory capacity from its factory configuration to the supported maximum of 32 GB total capacity, depending on the original memory modules installed.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 02 September 2021 |
Additional Notes
- The dual-channel architecture requires 2 matching modules to achieve the peak theoretical memory bandwidth supported by the Ryzen processor.
- The 32 GB threshold represents the firmware limitation for total addressable space across both physical slots.
- The ASUS ROG Strix G15 G513QM-HN185T utilizes a non-soldered configuration allowing for the total replacement of factory modules rather than relying on a fixed base capacity.
- Installing modules with higher frequency ratings will result in automatic downclocking to 3200 MHz due to chipset synchronization constraints.
- Accessing the SO-DIMM slots requires the careful disconnection of the internal battery and LED ribbon cables to prevent electrical shorting or physical tearing during the upgrade process.
- Optimal latency performance is contingent on selecting modules that support JEDEC timings at 1.2V without requiring XMP profiles which are often restricted in mobile BIOS environments.
- The physical layout of the internal cooling system dictates the use of standard height modules as heat spreaders may interfere with the bottom chassis panel fitment.