ASUS ROG G713QC-HX013T RAM upgrade specifications
ASUS ROG Strix G17 G713QC-HX013T RAM upgrade specifications include DDR4-SDRAM memory compatible with 2x SO-DIMM slots. Maximum RAM capacity reaches 32 GB total, with memory operating at 3200 MHz frequency. The upgrade supports standard SO-DIMM form factor modules, enabling users to expand the laptop's memory configuration for enhanced multitasking and performance capabilities.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 13 May 2021 |
Additional Notes
- The ASUS ROG G713QC-HX013T accepts DDR4 SO-DIMM modules exclusively, preventing installation of desktop DIMM memory or newer DDR5 standards.
- The 32 GB maximum capacity limitation stems from chipset addressing constraints, restricting individual module density to 16 GB per slot.
- The 3200 MHz frequency represents the highest stable speed supported by the memory controller, with faster modules automatically downclocking to this specification.
- Dual-channel architecture requires matched pairs for optimal bandwidth utilization, as mismatched modules force single-channel operation with approximately 50% bandwidth reduction.
- The SO-DIMM form factor necessitates modules measuring 67.6 mm in length, physically incompatible with standard 133.35 mm desktop memory dimensions.
- Accessing the memory slots typically requires bottom panel removal, though warranty preservation depends on whether original security seals remain intact during the upgrade process.
- Mixed capacity configurations function properly but prevent symmetric dual-channel operation, routing only the lowest common capacity through both channels.
- Voltage requirements default to 1.2V for standard DDR4 operation, with XMP profiles requiring BIOS support that may be absent in laptop implementations.
- CAS latency specifications affect real-world performance minimally at 3200 MHz, with CL22 modules performing within 2-3% of CL16 alternatives in typical workloads.
- Temperature management becomes critical above 85°C under sustained load, as DDR4 modules implement thermal throttling to prevent data corruption.