ASUS ROG GL502VY-FY024T RAM upgrade specifications

ASUS GL502VY-FY024T ASUS GL502VY-FY024T ASUS GL502VY-FY024T ASUS GL502VY-FY024T ASUS GL502VY-FY024T

The ASUS ROG Strix GL502VY-FY024T features DDR4-SDRAM memory upgrade capabilities. The laptop contains two SO-DIMM slots for RAM expansion, supporting a maximum memory capacity of 64 GB total. Compatible memory modules operate at 2133 MHz frequency and use the SO-DIMM form factor. Specifications enable users to upgrade from the factory configuration to the maximum supported capacity through these two accessible memory slots.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2133 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2133 (PC4-17064)
Bandwidth17.1 GB/s
Laptop Release date03 August 2017

Additional Notes

  • The 2133 MHz specification indicates DDR4-2133 operation, limiting maximum memory bandwidth to 17.0 GB/s per channel or 34.1 GB/s in dual-channel configuration.
  • Both memory slots utilize SO-DIMM form factor, requiring laptop-specific modules rather than desktop DIMM counterparts which are physically incompatible.
  • The 64 GB maximum capacity constraint allows only 2x32GB module configurations at the upper limit, eliminating flexibility for asymmetric configurations beyond this threshold.
  • DDR4-2133 represents the JEDEC baseline speed for DDR4, meaning higher-frequency modules (2400, 2666, 3200 MHz) will downclock to 2133 MHz if installed.
  • The 2-slot limitation requires complete replacement of existing modules when upgrading, as no additional slots exist for incremental capacity expansion.
  • Single-channel operation occurs if only 1 module is installed, reducing memory bandwidth by approximately 50% compared to dual-channel configuration with matched pairs.
  • SO-DIMM DDR4 modules operate at 1.2V standard voltage, differing from DDR3L (1.35V) and DDR3 (1.5V), preventing backward compatibility with previous generation memory.
  • The memory controller supports Error-Correcting Code (ECC) and non-ECC modules, though consumer SO-DIMMs typically lack ECC functionality due to cost considerations.
  • Module height restrictions in laptop chassis may prevent installation of certain high-density or heat-spreader-equipped SO-DIMMs, despite electrical compatibility.
  • The platform's Intel chipset dictates the 2133 MHz native speed, requiring XMP profile support for any overclocking beyond this specification, though most mobile platforms disable this feature.
  • Dual-rank modules may provide marginal performance improvements over single-rank alternatives at identical capacities, though compatibility varies by memory controller implementation.
  • Installing modules with mismatched speeds forces operation at the lowest common frequency, degrading potential performance when mixing specifications.