ASUS ROG GA401QE-K2186T RAM upgrade specifications

ASUS GA401QE-K2186T ASUS GA401QE-K2186T ASUS GA401QE-K2186T ASUS GA401QE-K2186T ASUS GA401QE-K2186T

ASUS ROG Zephyrus G14 model GA401QE-K2186T supports DDR4-SDRAM memory upgrade specifications. The laptop features one SO-DIMM memory slot for expansion, with maximum compatible RAM capacity of 24 GB total. Memory operates at 3200 MHz frequency. The upgrade configuration consists of on-board memory combined with the single SO-DIMM slot, allowing users to expand storage capacity by installing compatible DDR4 modules in the available slot.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM24 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date22 October 2021

Additional Notes

  • The presence of 8 GB of non-removable soldered memory dictates that the single available SO-DIMM slot accepts a maximum particle density of 16 GB to reach the total addressed limit.
  • Dual-channel memory architecture only functions symmetrically for the first 16 GB of total system RAM, while the remaining 8 GB operates in single-channel mode through asynchronous flex mode technology.
  • The ASUS ROG GA401QE-K2186T requires modules with an internal voltage of 1.2V to maintain stability and prevent thermal throttling within the compact chassis.
  • Installing a module with higher rated speeds will result in downclocking to 3200 MHz because the integrated memory controller is hardware-locked to the speed of the on-board chips.
  • Accessing the expansion slot necessitates the removal of the bottom panel, which carries a risk of static discharge to the permanent on-board memory array if not properly grounded.
  • Mixing modules with different CAS latencies will force the system to default to the slowest common timing profile, potentially increasing overall memory latency.
  • The physical height of the SO-DIMM slot is restricted by the slim laptop profile, requiring standard-height modules rather than those with thick integrated heat spreaders.