ASUS ROG GX701LXS-HG007T-BE RAM upgrade specifications

ASUS GX701LXS-HG007T-BE ASUS GX701LXS-HG007T-BE ASUS GX701LXS-HG007T-BE ASUS GX701LXS-HG007T-BE ASUS GX701LXS-HG007T-BE

ASUS ROG Zephyrus S GX701LXS-HG007T-BE laptop features DDR4-SDRAM memory upgrade specifications. The device contains 1x SO-DIMM slot for expansion, with maximum RAM capacity of 48 GB. Memory operates at 2933 MHz frequency. The upgrade configuration utilizes on-board memory combined with a single SO-DIMM slot, allowing compatible DDR4 modules to expand the system's total memory capacity. Specifications support standard laptop memory upgrades for enhanced multitasking and performance capabilities.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency2933 MHz
Maximum RAM48 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2933 (PC4-23464)
Bandwidth23.5 GB/s
Laptop Release date08 April 2020

Additional Notes

  • The ASUS ROG GX701LXS-HG007T-BE features soldered memory alongside a single expansion slot, limiting upgrade flexibility compared to dual-slot configurations.
  • The 48 GB maximum capacity indicates 16 GB of non-removable soldered RAM, restricting the single SO-DIMM slot to a 32 GB module to reach the system ceiling.
  • Mixing soldered and slotted memory modules may prevent dual-channel operation across the full capacity if the slot is populated with a module size that doesn't match the onboard configuration.
  • The 2933 MHz specification requires DDR4 modules validated at this speed, as faster modules will downclock to match the system's supported frequency.
  • SO-DIMM installation in this single-slot design requires complete disassembly of the bottom chassis, potentially voiding warranty seals in certain regions.
  • The hybrid memory architecture means replacing defective RAM becomes impossible if the soldered portion fails, requiring motherboard-level repair.
  • Achieving optimal memory bandwidth necessitates installing a 16 GB SO-DIMM to create matched pairs with the soldered capacity for symmetrical dual-channel access.
  • Third-party modules exceeding JEDEC voltage specifications for DDR4-2933 may cause stability issues due to thermal constraints within the compact chassis design.
  • The single expansion slot eliminates incremental upgrade paths, forcing users to purchase the maximum desired capacity in one transaction.