ASUS ROG GX701LXS-HG007T RAM upgrade specifications

ASUS GX701LXS-HG007T ASUS GX701LXS-HG007T ASUS GX701LXS-HG007T ASUS GX701LXS-HG007T ASUS GX701LXS-HG007T

The ASUS ROG Zephyrus S GX701LXS-HG007T supports DDR4-SDRAM memory upgrades with a maximum capacity of 48 GB. The laptop features one SO-DIMM slot for RAM expansion, with specifications compatible with DDR4 memory operating at 2933 MHz frequency. The memory configuration utilizes on-board memory combined with the available SO-DIMM slot, allowing users to upgrade the system's total RAM capacity through the compatible slot.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency2933 MHz
Maximum RAM48 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2933 (PC4-23464)
Bandwidth23.5 GB/s
Laptop Release date08 April 2020

Additional Notes

  • The presence of a single SO-DIMM slot implies that 16 GB of memory is permanently soldered to the motherboard of the ASUS GX701LXS-HG007T to reach the stated maximum capacity with a 32 GB module.
  • Dual-channel memory performance is restricted to the capacity of the soldered chip plus an equal amount of the installed module while additional capacity operates in single-channel mode.
  • Installing a memory module with a higher frequency results in an automatic downclock to 2933 MHz based on the limitations of the fixed on-board memory controller.
  • Upgrading the memory requires partial disassembly of the chassis which may involve navigating ribbon cables and thermal solutions situated over the single expansion slot.
  • Total system memory failure is a risk if the on-board chips malfunction as they cannot be replaced or bypassed through the expansion slot alone.
  • Memory latency timings will synchronize with the slower of the two components to ensure system stability during high-load operations.
  • Physical clearance within the thin chassis design necessitates the use of standard height SO-DIMM modules to avoid interference with the bottom panel or internal cooling pipes.