ASUS TUF Gaming FA507NV-LP053W RAM upgrade specifications

ASUS FA507NV-LP053W ASUS FA507NV-LP053W ASUS FA507NV-LP053W ASUS FA507NV-LP053W ASUS FA507NV-LP053W

ASUS TUF Gaming A15 FA507NV-LP053W laptop contains two SO-DIMM memory slots supporting DDR5-SDRAM upgrade specifications. Maximum RAM capacity reaches 32 GB total. Compatible memory modules operate at 4800 MHz frequency. Upgrade configurations allow installation of DDR5 SO-DIMM modules in both available slots to achieve maximum memory specifications for enhanced system performance.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR5-SDRAM
Frequency4800 MHz
Maximum RAM32 GB
Voltage1.1V
Number of pins262-pin
InterfacePC5
PC Speed RatingPC5-4800 (PC5-38400)
Bandwidth38.4 GB/s

Additional Notes

  • The ASUS TUF Gaming FA507NV-LP053W employs dual-channel SO-DIMM architecture, requiring matched memory modules in both slots to achieve optimal bandwidth utilization.
  • DDR5-4800 operates at JEDEC standard voltage of 1.1V, lower than DDR4's 1.2V requirement, reducing thermal output during sustained gaming sessions.
  • The 32 GB ceiling suggests a system architecture limited by chipset addressing capabilities or motherboard trace design rather than memory controller restrictions.
  • SO-DIMM modules measure 67.6mm in length compared to desktop DIMM's 133.35mm, preventing physical installation of standard desktop memory modules.
  • DDR5's dual-channel design places voltage regulation on each individual module rather than the motherboard, requiring compatible VRM circuitry on replacement sticks.
  • Native DDR5-4800 operation eliminates XMP profile dependency, reducing compatibility issues with third-party modules from manufacturers outside the original equipment supplier.
  • The 4800 MHz frequency represents effective data rate, with actual clock speed operating at 2400 MHz due to double data rate transfer protocol.
  • Mixing modules with different CAS latencies will force both sticks to operate at the slower timing specification, potentially degrading performance below single-module operation.
  • Accessing internal memory slots typically requires full bottom panel removal, voiding certain regional warranty protections despite upgrade-friendly design intentions.
  • DDR5's on-die ECC operates independently of system-level error correction, providing data integrity without requiring ECC-specific module variants.
  • The 32-bit data bus per module doubles to 64-bit in dual-channel mode, directly impacting integrated graphics performance more than discrete GPU operation.
  • Thermal sensors embedded in DDR5 modules enable real-time temperature monitoring through system management interfaces unavailable in DDR4 configurations.