ASUS TUF Gaming FA617NSR-DS71-CA RAM upgrade specifications

ASUS FA617NSR-DS71-CA ASUS FA617NSR-DS71-CA ASUS FA617NSR-DS71-CA ASUS FA617NSR-DS71-CA ASUS FA617NSR-DS71-CA

ASUS TUF Gaming A16 Advantage Edition FA617NSR-DS71-CA laptop features dual SO-DIMM slots compatible with DDR5-SDRAM memory modules. Maximum RAM capacity reaches 32 GB total with support for 4800 MHz frequency specifications. Compatible memory upgrades utilize SO-DIMM form factor modules. Current specifications allow expansion through two available memory slots for increased system performance and multitasking capability.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR5-SDRAM
Frequency4800 MHz
Maximum RAM32 GB
Voltage1.1V
Number of pins262-pin
InterfacePC5
PC Speed RatingPC5-4800 (PC5-38400)
Bandwidth38.4 GB/s

Additional Notes

  • Dual channel architecture requires matching memory module densities across both available slots to maintain peak memory bus bandwidth.
  • The 32 GB threshold indicates a firmware or chipset limitation that prevents the utilization of 32 GB high density modules in each slot.
  • Installing modules with lower latency timings than the factory defaults will result in the BIOS downclocking the hardware to the slowest common denominator.
  • Internal component access for the ASUS TUF Gaming FA617NSR-DS71-CA requires the removal of the bottom chassis panel which may involve various screw lengths necessitating careful organization to avoid motherboard damage during reassembly.
  • Integrated graphics performance scales directly with the available system memory speed and latency because the GPU shares the system pool for video buffering.
  • Compatibility is restricted to non ECC unbuffered memory modules as the system lacks the parity checking hardware required for error correction code support.
  • The use of memory speeds exceeding 4800 MHz will result in the hardware automatically capping the frequency to the maximum supported speed of the processor memory controller.
  • Thermal pads on existing memory modules should be preserved or replaced if degraded to ensure heat dissipation from the chips to the surrounding airflow.