ASUS TUF Gaming FX507ZC4-HN220W RAM upgrade specifications

ASUS FX507ZC4-HN220W ASUS FX507ZC4-HN220W ASUS FX507ZC4-HN220W ASUS FX507ZC4-HN220W ASUS FX507ZC4-HN220W

The ASUS TUF Gaming F15 FX507ZC4-HN220W laptop features DDR4-SDRAM memory specifications with two SO-DIMM slots for RAM upgrade compatibility. Maximum memory capacity reaches 32 GB total, supporting DDR4 modules operating at 3200 MHz frequency. Compatible SO-DIMM form factor modules enable memory expansion for enhanced multitasking and performance capabilities. Specifications allow for flexible upgrade options within the dual-slot architecture, accommodating various memory configurations up to the 32 GB maximum capacity threshold.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s

Additional Notes

  • The presence of 2 physical SO-DIMM slots confirms that the system operates in a dual-channel memory configuration, which significantly increases memory bandwidth compared to single-channel setups.
  • The 32 GB limit indicates a hardware-level firmware restriction on the maximum addressable density per slot, preventing the use of 32 GB high-capacity modules.
  • Utilizing DDR4 technology over newer standards results in lower power efficiency and higher latency but ensures broader compatibility with affordable aftermarket parts for the ASUS TUF Gaming FX507ZC4-HN220W.
  • Hardware upgrades require 260-pin non-ECC unbuffered modules to ensure system stability and boot success.
  • Operating at a 3200 MHz frequency restricts the CPU to synchronous 1:1 clock ratios, avoiding the performance penalties associated with asynchronous memory gearing.
  • Installation of memory modules with higher rated speeds will result in automatic downclocking to the system-defined 3200 MHz limit due to motherboard chipset constraints.
  • Replacing factory-installed memory does not void the standard manufacturer warranty provided that no physical damage occurs to the internal headers or adjacent components during the process.
  • The physical form factor requires low-profile modules to fit within the restricted vertical clearance of the chassis internal layout.