ASUS TUF Gaming FX507ZC4-HN226W RAM upgrade specifications

ASUS FX507ZC4-HN226W ASUS FX507ZC4-HN226W ASUS FX507ZC4-HN226W ASUS FX507ZC4-HN226W ASUS FX507ZC4-HN226W

ASUS TUF Gaming F15 model FX507ZC4-HN226W features DDR4-SDRAM memory upgrade specifications. The laptop includes 2x SO-DIMM slots compatible with DDR4 modules operating at 3200 MHz frequency. Maximum memory capacity reaches 32 GB when both slots are populated with compatible upgrades. RAM upgrades utilize SO-DIMM form factor modules. Specifications support DDR4-SDRAM technology for memory expansion and performance enhancement.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s

Additional Notes

  • The ASUS TUF Gaming FX507ZC4-HN226W accepts a maximum of 32 GB total, implying that each SO-DIMM slot supports up to 16 GB modules when populated with matching capacity sticks.
  • DDR4-3200 represents the native supported frequency, while higher-rated modules will typically downclock to match this specification if installed.
  • The dual SO-DIMM architecture enables dual-channel memory operation when identical modules occupy both slots, doubling theoretical bandwidth compared to single-channel configurations.
  • Mismatched module capacities or timings between the 2 slots may force the system into asymmetric or single-channel mode, reducing memory subsystem throughput.
  • SO-DIMM form factor physically differs from desktop DIMM modules, requiring laptop-specific memory modules with the shorter 260-pin connector.
  • The 32 GB ceiling reflects chipset or motherboard limitations rather than DDR4 technology constraints, as the standard itself supports higher densities.
  • Memory upgrades typically preserve manufacturer warranty when performed without disassembling soldered components, though confirmation through warranty documentation remains advisable.
  • Mixing DDR4 generations with different voltage requirements or non-standard XMP profiles may cause POST failures or stability issues during operation.
  • The 3200 MHz specification indicates PC4-25600 rating equivalency, which should be verified on replacement module packaging to ensure compatibility.
  • Both slots being user-accessible suggests no soldered memory configuration, allowing complete replacement rather than requiring supplementation of fixed modules.