ASUS Vivobook X412UA-EK333T RAM upgrade specifications

ASUS X412UA-EK333T ASUS X412UA-EK333T ASUS X412UA-EK333T ASUS X412UA-EK333T ASUS X412UA-EK333T

ASUS Vivobook 14 Series X412UA-EK333T laptop memory upgrade specifications include one SO-DIMM slot supporting DDR4-SDRAM modules. The system features onboard memory combined with one upgradeable slot, allowing maximum RAM capacity of 12 GB. Compatible memory operates at 2400 MHz frequency. Upgrade specifications indicate the single SO-DIMM slot accepts DDR4 memory modules to expand total system memory capacity beyond factory configuration.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM12 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date09 August 2019

Additional Notes

  • The presence of on-board memory means some RAM chips are soldered directly to the motherboard and cannot be replaced or removed.
  • System memory operates in a limited asymmetrical dual-channel configuration because only the capacity matching the soldered RAM benefits from dual-channel bandwidth.
  • The ASUS Vivobook X412UA-EK333T relies on a single expansion slot which restricts the total memory bandwidth compared to systems with dual independent slots.
  • Upgrading the existing SO-DIMM module requires the complete removal of the factory-installed stick as there are no vacant slots for expansion.
  • Installing a module with speeds higher than 2400 MHz results in an automatic down-clocking to match the fixed frequency of the soldered memory chips.
  • Exceeding the 12 GB limit likely leads to a failure to post or system instability due to hardware addressing limitations on the motherboard.
  • Accessing the SO-DIMM slot involves removing the base enclosure which may involve internal clips or hidden screws beneath rubber feet.
  • Heat dissipation for the memory is shared across the motherboard surface rather than dedicated cooling for the individual soldered modules.