ASUS Vivobook N552VX-FI050T RAM upgrade specifications

ASUS N552VX-FI050T ASUS N552VX-FI050T ASUS N552VX-FI050T ASUS N552VX-FI050T ASUS N552VX-FI050T

ASUS Vivobook Pro N552VX-FI050T RAM upgrade specifications include two SO-DIMM memory slots supporting DDR4-SDRAM modules. Maximum RAM capacity reaches 16 GB total. Compatible memory operates at 2133 MHz frequency. Upgrade options enable users to expand system memory using standard SO-DIMM form factor modules. Current specifications allow installation of DDR4 memory to enhance multitasking performance and system responsiveness on the N552VX-FI050T model.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2133 MHz
Maximum RAM16 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2133 (PC4-17064)
Bandwidth17.1 GB/s
Laptop Release date05 March 2019

Additional Notes

  • The ASUS Vivobook N552VX-FI050T chipset enforces a 16 GB total memory ceiling regardless of individual module capacity, preventing the installation of 2x16 GB configurations that would otherwise physically fit.
  • DDR4-2133 represents the baseline specification for this generation, limiting memory bandwidth to 17,066 MB/s per channel compared to later DDR4-2400 or DDR4-3200 standards that offer 19,200 MB/s and 25,600 MB/s respectively.
  • The dual SO-DIMM configuration operates in dual-channel mode only when matching capacity modules occupy both slots, halving theoretical bandwidth to single-channel 17,066 MB/s when using mismatched sizes.
  • Installing DDR4 modules rated above 2133 MHz triggers automatic downclocking to the base frequency, negating any performance premium paid for higher-speed memory kits.
  • Both memory slots require simultaneous access from the bottom panel, as one slot typically mounts on the motherboard underside while the second integrates into the main board surface.
  • Standard 260-pin SO-DIMM height clearance accommodates modules up to 32mm, though low-profile variants under 30mm reduce thermal interference with adjacent cooling components.
  • Operating voltage must conform to DDR4 standard 1.2V specification, as laptop BIOS implementations rarely support manual voltage adjustment for compatibility with high-performance 1.35V or 1.4V overclocking modules.
  • The 16 GB maximum suggests a non-HM170 chipset implementation, likely HM110 or similar entry-tier variant that restricts addressable memory compared to workstation-class alternatives supporting 32 GB or 64 GB.
  • Memory replacement maintains warranty validity as a user-serviceable upgrade, unlike soldered configurations that void coverage upon tampering attempts.
  • Single-rank versus dual-rank module topology affects latency characteristics at identical frequencies, with dual-rank DIMMs introducing marginal performance gains in memory-intensive workloads despite identical 2133 MHz speed ratings.