HP OMEN 15-dc0006no RAM upgrade specifications

HP 15-dc0006no HP 15-dc0006no HP 15-dc0006no HP 15-dc0006no HP 15-dc0006no

HP OMEN 15-dc0006no laptop compatible with DDR4-SDRAM memory upgrade specifications. The system features 2x SO-DIMM slots supporting maximum RAM capacity of 32 GB. Memory modules operate at 2666 MHz frequency. Each slot accepts SO-DIMM form factor memory modules. Upgrade specifications enable expansion from factory configuration to full 32 GB capacity through compatible DDR4 memory installation in available slots.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date21 June 2018

Additional Notes

  • The HP OMEN 15-dc0006no supports dual-channel memory operation through its 2 SO-DIMM slots, enabling doubled memory bandwidth when identical modules are installed in pairs.
  • The 32 GB maximum capacity indicates chipset-level restrictions that prevent recognition of higher-density modules, even if physically compatible.
  • DDR4-2666 represents JEDEC standard speed, meaning modules rated at higher frequencies will downclock to 2666 MHz unless XMP profiles are supported and enabled in BIOS.
  • SO-DIMM form factor limits module height to 30 mm, eliminating compatibility with standard desktop DIMM modules despite identical electrical specifications.
  • Memory frequency of 2666 MHz delivers 21.3 GB/s theoretical bandwidth per channel, totaling 42.6 GB/s in dual-channel configuration.
  • Mixing modules with different speeds forces all installed memory to operate at the lowest common frequency, creating potential performance degradation.
  • SO-DIMM slots typically allow warranty-safe user access through dedicated service panels, unlike soldered memory configurations that prohibit field upgrades.
  • DDR4 voltage standardization at 1.2V ensures thermal compatibility within laptop cooling constraints, unlike DDR3L or earlier high-voltage standards.
  • The 2666 MHz specification establishes CAS latency expectations of CL19 for standard modules, affecting absolute memory access times despite frequency parity.
  • Dual-slot configuration permits asymmetric capacity combinations while maintaining dual-channel operation, though matching capacities optimizes interleaving efficiency.
  • DDR4 non-ECC unbuffered modules represent the only compatible architecture, as registered or error-correcting variants require different chipset support.