HP Probook 445 G7 (3x 12X09EA) RAM upgrade specifications

HP 445 G7 (3x 12X09EA) HP 445 G7 (3x 12X09EA) HP 445 G7 (3x 12X09EA) HP 445 G7 (3x 12X09EA) HP 445 G7 (3x 12X09EA)

The HP ProBook 445 G7 features DDR4-SDRAM memory configuration with 2x SO-DIMM slots available for upgrade. Maximum memory capacity reaches 16 GB, operating at 2400 MHz frequency. Compatible RAM modules utilize SO-DIMM form factor specifications. Memory upgrade options support standard DDR4 specifications matching the laptop's original equipment manufacturer standards.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM16 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date31 May 2020

Additional Notes

  • The HP ProBook 445 G7 (3x 12X09EA) accepts only standard-height SO-DIMM modules, as low-profile variants are incompatible with notebook memory slots despite sharing the same 260-pin interface.
  • The 16 GB ceiling imposes a practical limit of either a single 16 GB module or dual 8 GB modules, with the latter configuration enabling dual-channel operation for improved memory bandwidth.
  • DDR4-2400 represents the locked operational speed regardless of module specifications, meaning higher-rated memory (2666 MHz, 3200 MHz) will downclock to match the system's native frequency.
  • Dual-channel activation requires identical capacity modules in both slots, as asymmetric configurations (such as 4 GB paired with 8 GB) will either operate in single-channel mode or engage flex mode with reduced performance.
  • Non-ECC unbuffered modules are required, as registered or ECC memory types designed for server platforms will fail POST or remain undetected in consumer-grade systems.
  • The integrated Ryzen APU shares system memory for graphics processing, effectively reducing available RAM for applications when allocated to the GPU frame buffer.
  • Mixing modules from different manufacturers or with different rank configurations (single-rank versus dual-rank) may cause stability issues despite matching speed and capacity specifications.
  • Operating voltage is standardized at 1.2V for DDR4, but modules rated for lower voltages will not provide power savings in systems lacking dynamic voltage control.
  • Upgrading beyond factory configuration typically preserves warranty status when using JEDEC-compliant modules, though XMP-profiled gaming memory offers no advantage due to absent profile support in business-class firmware.