HP Probook 455 G6 RAM upgrade specifications

HP 455 G6 HP 455 G6 HP 455 G6 HP 455 G6 HP 455 G6

HP Probook 455 G6 laptop memory upgrade specifications include two SO-DIMM slots supporting DDR4-SDRAM memory modules. Maximum RAM capacity reaches 16 GB total across both slots. Compatible memory operates at 2400 MHz frequency. Upgrade specifications indicate SO-DIMM form factor for memory module compatibility. Standard configurations support capacity expansion up to maximum specifications through compatible DDR4 memory upgrades in available slots.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2400 MHz
Maximum RAM16 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2400 (PC4-19200)
Bandwidth19.2 GB/s
Laptop Release date31 March 2019

Additional Notes

  • The HP ProBook 455 G6 restricts total memory capacity to 16 GB across both slots, limiting module pairing to either 2x8 GB or asymmetric configurations like 4 GB plus 12 GB.
  • Installing a single module disables dual-channel operation, reducing memory bandwidth by approximately 50 percent compared to matched pairs.
  • Modules rated above 2400 MHz will downclock to match the chipset's maximum supported frequency, offering no performance advantage despite higher cost.
  • SO-DIMM form factor physically differs from standard desktop DIMM modules, making consumer desktop memory incompatible regardless of speed or capacity ratings.
  • DDR3 modules are electrically incompatible with DDR4 slots due to different notch positions and voltage requirements, preventing physical insertion and avoiding damage.
  • Access to memory slots typically requires removing the bottom service panel, which may void warranty seals depending on regional service policies.
  • Mixing modules with different latency timings forces both modules to operate at the slower timing specification, potentially degrading responsiveness in memory-intensive applications.
  • The 16 GB ceiling may constrain virtual machine deployment, limiting simultaneous instances when allocating 4 GB or more per guest operating system.
  • Non-ECC unbuffered modules are required; server-grade ECC or registered memory will either fail POST checks or remain unrecognized by the system BIOS.
  • Operating modules beyond JEDEC standard voltage specifications increases thermal output within the confined laptop chassis, potentially triggering thermal throttling under sustained workloads.