MSI Creator 17 B11UH-236 RAM upgrade specifications
MSI Creator 17 B11UH-236 laptop RAM upgrade specifications include two SO-DIMM memory slots supporting DDR4-SDRAM modules. Maximum RAM capacity reaches 64 GB when fully upgraded. Compatible memory operates at 3200 MHz frequency. Specifications detail the socket configuration and upgrade potential for this mobile workstation model within the Creator product family.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 22 May 2021 |
Additional Notes
- The MSI Creator 17 B11UH-236 supports dual-channel memory architecture through its 2 slots, enabling potential bandwidth doubling when matched modules are installed in both positions.
- Achieving the 64 GB ceiling requires 2 modules of 32 GB each, as single-slot configurations will leave half the maximum capacity unused.
- The 3200 MHz specification indicates PC4-25600 modules are required for native speed operation without downclocking.
- Installing modules with different speeds will force all memory to operate at the frequency of the slowest module present.
- SO-DIMM form factor modules measure 67.6 mm in length, physically incompatible with standard 133.35 mm DIMM modules used in desktop systems.
- DDR4 SO-DIMM modules use 260-pin connectors, making DDR3 or DDR5 modules mechanically incompatible regardless of capacity or speed ratings.
- Operating voltage for DDR4-SDRAM typically runs at 1.2V, with lower power draw compared to legacy DDR3 1.5V standards.
- Memory upgrades in laptops with 2 slots require removal of existing modules to reach higher capacities, unlike 4-slot configurations that allow incremental expansion.
- Unmatched module pairs may function but could prevent dual-channel mode activation, halving theoretical memory bandwidth from 51.2 GB/s to 25.6 GB/s per channel.
- Intel 11th generation platform compatibility suggests support for JEDEC standard timings, though XMP profiles may require BIOS configuration access.
- Non-ECC unbuffered modules are standard for this consumer platform, as ECC or registered memory types will not initialize properly during boot.
- Physical access to memory slots in this model requires bottom panel removal, with procedures potentially affecting warranty status depending on regional regulations.