MSI Gaming GE62 6QD(Apache Pro)-670XFR RAM upgrade specifications

MSI GE62 6QD(Apache Pro)-670XFR MSI GE62 6QD(Apache Pro)-670XFR MSI GE62 6QD(Apache Pro)-670XFR MSI GE62 6QD(Apache Pro)-670XFR MSI GE62 6QD(Apache Pro)-670XFR

MSI GE62 6QD(Apache Pro)-670XFR gaming laptop RAM upgrade specifications feature DDR4-SDRAM memory compatibility. The system contains 2x SO-DIMM slots for memory expansion, supporting maximum capacity of 32 GB total RAM. Compatible memory operates at 2133 MHz frequency and uses SO-DIMM form factor. Upgrade specifications indicate DDR4 technology for enhanced performance in the GE series gaming platform.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2133 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2133 (PC4-17064)
Bandwidth17.1 GB/s
Laptop Release date10 March 2016

Additional Notes

  • The 32 GB ceiling enforces a 16 GB per module configuration when maximizing capacity, as only 2 SO-DIMM sockets are available.
  • DDR4-2133 operates at PC4-17000 bandwidth standard, delivering 17.06 GB/s theoretical throughput per channel in dual-channel mode.
  • Modules rated above 2133 MHz will downclock to match the supported frequency, making higher-speed purchases cost-ineffective without performance gain.
  • The MSI GE62 6QD Apache Pro 670XFR requires non-ECC unbuffered modules, as registered or ECC variants physically incompatible with consumer SO-DIMM slots.
  • Dual-channel activation mandates identical capacity and matching specifications across both populated slots for optimal memory interleaving.
  • CAS latency tolerances at DDR4-2133 typically range from CL15 to CL17, with tighter timings yielding marginal real-world performance differences in gaming workloads.
  • SO-DIMM height clearance in this chassis generation typically accommodates standard 30mm profile modules, though low-profile variants remain unnecessary.
  • Operating voltage must remain at 1.2V JEDEC standard to prevent motherboard power delivery instability or potential component damage.
  • Single-module configurations halve memory bandwidth by disabling dual-channel architecture, creating performance bottlenecks in GPU-intensive applications.
  • Mixed-brand installations risk timing incompatibilities despite matching advertised speeds, potentially forcing the system to apply conservative fallback profiles.
  • The 6th-generation platform predates XMP 3.0, limiting automatic overclocking profile compatibility to XMP 2.0 specifications if supported by BIOS.
  • Temperature tolerances for DDR4 at 2133 MHz remain well within passive cooling thresholds, eliminating the need for aftermarket heat spreaders in mobile configurations.