MSI Gaming GE76 10UG-471 Dragon Tiamat RAM upgrade specifications
The MSI GE76 10UG-471 Dragon Tiamat Gaming series laptop contains 2x SO-DIMM memory slots supporting DDR4-SDRAM upgrade capacity. Maximum RAM compatible with this model reaches 64 GB total memory. Each slot accommodates SO-DIMM form factor modules operating at 3200 MHz frequency. Specifications allow for modular memory upgrades to expand the laptop's existing RAM capacity within the 64 GB maximum threshold. DDR4-SDRAM modules matching 3200 MHz specifications are compatible with the GE76 10UG-471 Dragon Tiamat platform.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 19 January 2021 |
Additional Notes
- Dual slot architecture necessitates a symmetrical module configuration to activate dual channel bandwidth and prevent memory controller downclocking.
- Maximum capacity reach of 64 GB requires the replacement of all preinstalled modules since no vacant expansion slots exist on the MSI GE76 10UG-471 Dragon Tiamat motherboard.
- Utilization of 3200 MHz modules ensures a 1:1 ratio with the processor bus speed, eliminating artificial latency spikes caused by asynchronous clock cycles.
- Physical installation of memory requires the removal of the entire bottom chassis cover, which contains fragile plastic retention clips and integrated thermal dissipation pads.
- Internal component access involves breaking a factory seal which affects regional warranty status depending on local consumer protection laws regarding user serviceable parts.
- Memory modules exceeding standard JEDEC voltages are likely to cause system instability as the BIOS typically lacks manual voltage offsets for high performance RAM profiles.
- The presence of 2 SO-DIMM slots implies that reaching the ceiling of 64 GB requires high density 32 GB sticks which may increase heat output within the localized memory area of the chassis.