MSI Gaming GE76 10UG-488ES Dragon Tiamat RAM upgrade specifications

MSI GE76 10UG-488ES Dragon Tiamat MSI GE76 10UG-488ES Dragon Tiamat MSI GE76 10UG-488ES Dragon Tiamat MSI GE76 10UG-488ES Dragon Tiamat MSI GE76 10UG-488ES Dragon Tiamat

The MSI GE76 10UG-488ES Dragon Tiamat gaming laptop features DDR4-SDRAM memory specifications configured with 2x SO-DIMM slots. Maximum RAM capacity reaches 64 GB total, supporting DDR4 modules at 3200 MHz frequency. The SO-DIMM form factor enables RAM upgrade compatibility with standard laptop memory modules. Memory specifications provide upgrade pathways for enhanced multitasking and performance within Gaming series GE76 architecture.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date16 January 2021

Additional Notes

  • The 64 GB ceiling requires two 32 GB modules, which must be verified against the chipset's per-slot density limits before purchase.
  • DDR4-3200 operation depends on the processor's memory controller supporting JEDEC or XMP profiles at that frequency under dual-channel configuration.
  • SO-DIMM installation in the MSI GE76 10UG-488ES Dragon Tiamat typically requires bottom panel removal, which may void seals on certain regional warranty programs.
  • Mixing modules with different CAS latencies will force all sticks to operate at the slowest timing, creating performance inconsistency in memory-intensive workloads.
  • Single-channel population halves theoretical bandwidth to approximately 25.6 GB/s, creating bottlenecks in gaming scenarios that rely on GPU-CPU data transfers.
  • Non-matching module ranks between slots can prevent dual-channel activation despite identical capacity specifications.
  • The 10th-generation Intel platform supports DDR4-2933 natively, meaning 3200 MHz operation requires motherboard support for overclocked profiles.
  • ECC SO-DIMM modules are incompatible with consumer mobile platforms even when physically fitting the slot.
  • High-density modules above 16 GB per stick may require BIOS updates to ensure proper detection and stability.
  • Thermal constraints in gaming laptops can throttle DDR4-3200 modules lacking integrated heat spreaders during sustained memory-intensive operations.