MSI Gaming GF63 10SC-058XIT Thin RAM upgrade specifications

MSI GF63 10SC-058XIT Thin MSI GF63 10SC-058XIT Thin MSI GF63 10SC-058XIT Thin MSI GF63 10SC-058XIT Thin MSI GF63 10SC-058XIT Thin

The MSI GF63 10SC-058XIT Thin Gaming series laptop features DDR4-SDRAM memory upgrade specifications with two SO-DIMM slots for RAM expansion. Maximum supported memory capacity reaches 64 GB, with compatible DDR4 modules operating at 3200 MHz frequency. SO-DIMM form factor modules are required for RAM upgrade compatibility on this Gaming GF series model. Specifications support dual-channel memory configuration for enhanced performance in the GF63 10SC-058XIT Thin platform.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date08 February 2021

Additional Notes

  • The MSI GF63 10SC-058XIT Thin supports dual-channel memory architecture through its 2 SO-DIMM slots, enabling potential bandwidth doubling when matched modules are installed in both slots simultaneously.
  • The 3200 MHz frequency specification indicates DDR4-3200 compatibility, which corresponds to PC4-25600 modules with a theoretical maximum bandwidth of 25.6 GB/s per channel.
  • The 64 GB maximum capacity allows installation of 2 modules at 32 GB each, though this configuration requires higher-density DRAM chips that may carry different latency characteristics compared to lower-capacity modules.
  • Mixing modules with different speeds will force all installed memory to operate at the frequency of the slowest module, potentially underutilizing faster RAM if mismatched.
  • The SO-DIMM form factor excludes standard desktop DIMM modules, requiring specifically laptop-sized memory for physical compatibility with the motherboard slots.
  • Systems populated with a single module will operate in single-channel mode, halving theoretical memory bandwidth and potentially creating performance bottlenecks in graphics-intensive applications that rely on integrated or shared video memory.
  • DDR4 generation compatibility excludes both older DDR3 and newer DDR5 modules due to different pin configurations and voltage requirements, with DDR4 operating at 1.2V standard.
  • Upgrading beyond factory-installed capacity may require BIOS recognition of higher-density modules, though the stated 64 GB maximum suggests firmware support for 32 GB SO-DIMMs.
  • Access to memory slots typically requires bottom panel removal, and some manufacturers void warranties if non-certified technicians perform upgrades, warranting verification of user-serviceable component policies before proceeding.
  • CAS latency timings are not enforced by the specification, meaning modules with identical frequency but different CL ratings (CL16, CL18, CL22) will exhibit measurable performance variance in latency-sensitive workloads.