MSI Gaming GF63 10SC-243 Thin RAM upgrade specifications
The MSI GF63 10SC-243 Thin gaming laptop features DDR4-SDRAM memory upgrade specifications. The device contains 2x SO-DIMM slots supporting a maximum RAM capacity of 64 GB. Memory operates at 2933 MHz frequency. Compatible upgrades utilize SO-DIMM form factor modules. The GF series gaming laptop supports memory expansion through dual upgrade slots, enabling users to configure RAM capacity according to performance requirements and workload demands.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2933 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2933 (PC4-23464) |
| Bandwidth | 23.5 GB/s |
| Laptop Release date | 22 July 2021 |
Additional Notes
- Dual-channel memory architecture is only achievable when both SO-DIMM slots are populated with identical modules, doubling the available memory bandwidth for CPU-intensive tasks.
- The 2933 MHz frequency limit indicates that installing higher-rated 3200 MHz modules will result in the hardware automatically clocking down to match the 10th Gen Intel processor memory controller limitations.
- Upgrading the MSI GF63 10SC-243 Thin to the 64 GB maximum requires the removal of all factory-installed modules, as no additional slots exist beyond the primary 2.
- Physical installation is restricted to 260-pin DDR4 SO-DIMM modules, as desktop-sized DIMMs are incompatible with the compact internal chassis height.
- Mixing modules with different CAS latencies or timings will force the system to operate at the speed of the slowest installed stick, potentially increasing system-wide latency.
- Internal access for memory replacement necessitates the removal of the bottom base cover, which involves navigating plastic clips that are prone to breakage if improper tools are used.
- The 1.2V DDR4 standard ensures that high-capacity 32 GB modules do not exceed the thermal dissipation capabilities of the localized motherboard area under sustained loads.