MSI Gaming GF65 10SDR-1230IT Thin RAM upgrade specifications
The MSI GF65 10SDR-1230IT Thin Gaming series laptop features two SO-DIMM slots for DDR4-SDRAM memory upgrades. The system supports DDR4 memory operating at 3200 MHz frequency, with maximum memory capacity of 64 GB. Both memory slots are accessible for upgrade, accommodating standard SO-DIMM form factor modules. Compatible DDR4-SDRAM specifications enable expansion from the factory configuration to the maximum 64 GB capacity. The GF65 Thin model supports dual-channel memory configuration through slots supporting identical capacity modules for optimized performance specifications.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 16 January 2021 |
Additional Notes
- The dual channel architecture requires symmetrical module pairs to achieve maximum theoretical memory bandwidth for the MSI GF65 10SDR-1230IT Thin.
- The presence of 2 physical slots necessitates the removal of existing modules to reach the 64 GB threshold since no additional expansion headers are available.
- Operating at 3200 MHz requires modules with matching JEDEC profiles to ensure system stability without manual BIOS timing adjustments.
- Physical installation is limited to 260 pin small outline modules which are specific to mobile motherboards and incompatible with desktop sized hardware.
- The thermal design of the chassis suggests that high density 32 GB modules should possess low voltage ratings to minimize heat generation in the localized slot area.
- Upgrading to the 64 GB capacity provides sufficient overhead for memory intensive virtualization and high resolution video editing tasks that exceed standard gaming requirements.
- Accessing the SO-DIMM slots involves removing the base panel which typically exposes the cooling assembly and requires specific tools to avoid damaging plastic clips.