MSI Gaming GF75 10UEK-011CA Thin RAM upgrade specifications
MSI GF75 10UEK-011CA Thin gaming laptop supports DDR4-SDRAM memory upgrades with two SO-DIMM slots. Maximum RAM capacity reaches 64 GB total. Memory operates at 3200 MHz frequency. Upgrade specifications indicate compatibility with SO-DIMM form factor modules. Current configuration allows for memory expansion across both available slots to achieve maximum capacity supported by the GF series specifications.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 29 March 2021 |
Additional Notes
- The dual-slot configuration permits dual-channel memory architecture, which significantly increases memory bandwidth for CPU-intensive tasks compared to single-stick configurations.
- The maximum capacity threshold of 64 GB requires the use of high-density 32 GB modules in both slots, as additional expansion beyond this point is physically impossible due to the lack of secondary banks.
- Physical installation in the MSI GF75 10UEK-011CA Thin typically involves the removal of the entire bottom chassis cover, which may require piercing a factory seal sticker applied over a screw hole.
- Operating at the maximum supported frequency relies on the internal memory controller compatibility, as modules with higher clock speeds will downclock to align with the system bus limitations.
- Latency performance is determined by the lowest common denominator when mixing modules, making identical kits preferable to avoid timing mismatches or system instability.
- The SO-DIMM form factor restricts hardware selection to 260-pin laptop modules, ensuring non-compatibility with desktop-grade hardware.
- Thermal management within the thin chassis design remains a factor during heavy utilization, although DDR4 modules generally maintain low power consumption and heat output.