MSI Gaming GP76 10UG-260FR Leopard RAM upgrade specifications
The MSI GP76 10UG-260FR Leopard gaming laptop supports DDR4-SDRAM memory upgrades with two SO-DIMM slots. Maximum compatible RAM capacity reaches 64 GB total. Memory modules operate at 3200 MHz frequency. The gaming series laptop accepts standard SO-DIMM form factor memory upgrades. Specifications allow for flexible memory configurations to enhance system performance capabilities.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 30 January 2021 |
Additional Notes
- The dual channel architecture requires symmetrical module pairs to achieve maximum memory bandwidth and prevent single channel bottlenecking during high refresh rate gaming.
- Upgrading the MSI GP76 10UG-260FR Leopard to the maximum threshold involves the removal of any factory installed chips since the total capacity is divided across only 2 physical slots.
- Achieving the rated 3200 MHz frequency depends on the integrated memory controller of the 10th generation processor which might downclock modules to 2933 MHz depending on the specific CPU SKU installed.
- Physical installation necessitates a non-marring pry tool to release the plastic clips of the bottom chassis plate which serves as the primary barrier to the internal SO-DIMM bays.
- Low latency performance is contingent upon selecting modules with matching CAS latency values to avoid the system defaulting to the slowest shared timing profile.
- The absence of soldered memory on the motherboard ensures that the entire system memory remains serviceable if a single module suffers a hardware failure.
- Thermal pads on the RAM modules may require realignment or replacement during an upgrade to maintain consistent heat dissipation within the compact internal enclosure.