MSI Gaming GS73 8RF-026CA Stealth RAM upgrade specifications
The MSI GS73 8RF-026CA Stealth gaming laptop features dual SO-DIMM slots supporting DDR4-SDRAM memory modules. The system accommodates maximum RAM capacity of 32 GB total, with compatible upgrades utilizing the SO-DIMM form factor. Current specifications document DDR4 memory operating at 266 MHz frequency. Upgrade options allow users to expand memory capacity by replacing or adding compatible DDR4-SDRAM modules in either of the two available slots. The MSI GS gaming series specifications support standard DDR4 memory configurations for enhanced multitasking and application performance.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 266 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-266 (PC4-2128) |
| Bandwidth | 2.1 GB/s |
| Laptop Release date | 16 September 2018 |
Additional Notes
- The 266 MHz specification represents the memory controller's reference clock, not the actual data transfer rate. DDR4 modules for this system operate at 2133 MHz minimum (8x multiplier), meaning effective throughput reaches 17 GB/s even with conservative timings.
- The 2 SO-DIMM slot configuration permits maximum capacity of 32 GB only when populated with 2x 16 GB modules. Single-slot upgrades cannot exceed 16 GB per module due to physical constraints of the form factor.
- DDR4 SO-DIMM modules are not backward compatible with DDR3 SO-DIMM slots. Verification of the existing memory type in this system is required before purchasing replacement modules, as model year variations may affect compatibility.
- Gaming workloads on this platform benefit from matched memory pairs operating in dual-channel mode. Mismatched capacity or speed configurations force the system to operate in single-channel mode on one module, reducing available bandwidth by approximately 50 percent and increasing latency to storage subsystems.
- The thermal design of ultrabook gaming laptops like this model often constrains airflow around SO-DIMM slots. High-profile heatspreaders on some DDR4 modules may physically contact internal chassis components or cooling elements, requiring low-profile variants for safe installation.
- Upgrading beyond the factory configuration voids most manufacturer warranties unless performed by authorized service centers. Third-party installation of memory modules on sealed gaming laptops typically requires removal of the bottom panel and may affect pressure-sensitive adhesive seals used for waterproofing claims.