MSI Gaming GS75 Stealth-249 RAM upgrade specifications
The MSI GS75 Stealth-249 gaming laptop features DDR4-SDRAM memory with two SO-DIMM slots supporting maximum capacity of 64 GB. The Gaming GS series model is compatible with DDR4 memory modules operating at 2666 MHz frequency. RAM upgrade specifications indicate SO-DIMM form factor compatibility for expansion, allowing users to enhance system memory beyond factory configuration up to the maximum supported capacity.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2666 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2666 (PC4-21328) |
| Bandwidth | 21.3 GB/s |
| Laptop Release date | 29 March 2019 |
Additional Notes
- The inverted motherboard design of the MSI GS75 Stealth-249 necessitates a full teardown of the internal chassis to access the SO-DIMM slots located on the underside of the PCB.
- Dual channel memory architecture requires installing 2 matched modules to maximize memory bandwidth and prevent CPU performance throttling during high load gaming tasks.
- System stability depends on using modules that support JEDEC standard timings because the BIOS typically lacks XMP profile support for overclocked memory speeds.
- Upgrading to the maximum 64 GB capacity limits the motherboard to 2 rank configurations per channel which can increase heat localized around the central processor area.
- Replacing an individual pre-installed module with a higher capacity stick forces the system into flex mode results in asymmetrical memory operation and reduced data throughput.
- Physical clearance for memory modules is restricted by the ultra thin chassis profile meaning high profile heat spreaders will interfere with the bottom panel closure.
- Internal component density requires the use of non-conductive tools and battery disconnection before handling the SO-DIMM slots to avoid short circuiting the surface mounted components.