MSI Gaming GS76 11UE-230XES Stealth RAM upgrade specifications
The MSI GS76 11UE-230XES Stealth Gaming series laptop features DDR4-SDRAM memory specifications supporting up to 64 GB maximum RAM capacity. The system contains two SO-DIMM slots for memory upgrades, accommodating DDR4 modules operating at 3200 MHz frequency. Compatible upgrade options allow users to install matching memory modules in the available slots to enhance multitasking and performance capabilities. The SO-DIMM form factor specifications define the physical dimensions required for compatible RAM upgrades with this particular Gaming GS series model.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 23 July 2021 |
Additional Notes
- The 2 SO-DIMM slot configuration supports dual-channel memory architecture, enabling symmetric bandwidth utilization across both memory controllers. Asymmetric population (single module installation) degrades throughput by approximately 50% in bandwidth-sensitive workloads.
- DDR4-3200 rated frequency operates within standard JEDEC specifications for 11th-generation Intel platforms. Memory modules exceeding 3200 MHz require manual BIOS overclocking, which may void manufacturer coverage on memory-related failures.
- The 64 GB capacity ceiling reflects SO-DIMM physical constraints and platform BIOS limitations. Individual modules are limited to 32 GB density; achieving maximum capacity requires 2x32 GB replacement pairs.
- SO-DIMM form factor mandates low-profile module height (approximately 30 mm). Standard-height or registered DIMM variants cannot physically install in the MSI GS76 11UE-230XES Stealth chassis, despite matching DDR4 electrical specifications.
- Upgrading beyond stock configuration requires removal of original modules to access the SO-DIMM slots located beneath the keyboard or bottom panel. No expansion bay exists; replacement is the only upgrade pathway.
- Mixed-generation DDR4 modules (differing speeds or latencies) operate at the slowest rated frequency among installed pairs. Pairing legacy 2666 MHz modules with new 3200 MHz stock modules forces downclocking of the faster module to 2666 MHz.
- Thermal headroom in gaming laptops influences memory stability during sustained load. SO-DIMM proximity to high-heat components (CPU, GPU) may necessitate lower-latency modules (CAS 16 or tighter) to maintain error-free operation during extended gaming sessions.