MSI Prestige 15 A11SCX-217 RAM upgrade specifications
MSI Prestige 15 A11SCX-217 laptop features DDR4-SDRAM memory upgrade specifications. The system includes 2x SO-DIMM slots supporting maximum RAM capacity of 64 GB. Memory upgrade modules are compatible with DDR4-3200 MHz frequency specifications. SO-DIMM form factor memory modules are required for RAM upgrade compatibility. Maximum memory capacity represents the total memory supported across both available slots. Specifications enable users to expand memory from factory configuration to support demanding applications and multitasking requirements.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 64 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 30 November 2020 |
Additional Notes
- Dual channel memory architecture requires installing identical capacity modules across both slots to maximize memory bandwidth for integrated and discrete graphics processing.
- The MSI Prestige 15 A11SCX-217 utilizes a standardized 260 pin physical interface which ensures compatibility with third party high performance modules provided the voltage remains at the 1.2V JEDEC standard.
- Upgrading to the 64 GB limit involves replacing existing factory modules rather than adding to them because all available physical pathways are occupied by the 2 existing slots.
- Populating both slots reduces system latency compared to single channel configurations which often causes frame rate stutter in creative applications.
- The 3200 MHz frequency dictates that any installed memory with higher rated speeds will automatically downclock to match the hardware controller limitations of the chipset.
- Internal motherboard layout requires the removal of the entire bottom chassis cover and potentially delicate heat pipe assemblies to access the SO-DIMM area for hardware swaps.
- Thermal constraints within the thin chassis design mean that modules with integrated heat spreaders might interfere with the physical closure of the casing.