MSI Prestige PS63 Modern-085 RAM upgrade specifications
MSI Prestige PS63 Modern-085 RAM upgrade specifications detail DDR4-SDRAM memory compatibility with 2x SO-DIMM slots supporting maximum capacity of 32 GB total. Compatible memory modules operate at 2666 MHz frequency using SO-DIMM form factor. Upgrade specifications enable users to expand laptop memory from factory configurations to specified maximum capacity limits. Memory specifications remain compatible with MSI PS63 Modern-085 hardware architecture and system requirements.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2666 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2666 (PC4-21328) |
| Bandwidth | 21.3 GB/s |
| Laptop Release date | 09 April 2019 |
Additional Notes
- Dual channel memory architecture requires installing matched modules in both slots to maximize memory bandwidth and avoid performance bottlenecks in multi threaded applications.
- The presence of 2 dedicated slots allows for a 32 GB configuration using two 16 GB modules, which facilitates high resolution video editing and large dataset processing on the MSI Prestige PS63 Modern-085.
- System latency is fixed by the 2666 MHz controller limit, meaning higher frequency RAM modules will automatically downclock to match the hardware cap without providing any speed advantages.
- Physical installation requires SO-DIMM form factor modules, as desktop style DIMM memory is incompatible with the internal motherboard clearance and connector layout.
- Full capacity utilization necessitates a 64 bit operating system to address and manage memory resources exceeding the 4 GB architectural limit.
- Replacement of existing modules is required for upgrades if both slots are occupied, as the motherboard does not feature any non removable or soldered memory banks.
- Voltage compatibility must be verified at 1.2V to ensure thermal stability and prevent electrical damage to the low power mobile chipset.