MSI Summit E15 A11SCST-206 RAM upgrade specifications

MSI E15 A11SCST-206 MSI E15 A11SCST-206 MSI E15 A11SCST-206 MSI E15 A11SCST-206 MSI E15 A11SCST-206

MSI E15 A11SCST-206 Summit series laptop features DDR4-SDRAM memory upgrade capacity specifications. The device contains 2x SO-DIMM slots supporting maximum RAM expansion to 64 GB. Compatible memory modules operate at 3200 MHz frequency. Upgrade specifications utilize SO-DIMM form factor for memory compatibility. The E15 A11SCST-206 model accommodates DDR4 memory upgrades within specified slot configuration and maximum capacity limits.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date30 November 2020

Additional Notes

  • Dual channel memory architecture requires installing identical capacity modules across both slots to maximize integrated graphics performance and system bus throughput.
  • The presence of 2 physical SO-DIMM slots implies that existing factory memory must be discarded or sold if both slots are occupied when reaching the 64 GB threshold.
  • Internal access for memory replacement on the MSI Summit E15 A11SCST-206 involves removing the bottom chassis panel which may trigger a factory seal breach depending on regional warranty policies.
  • Operating at 3200 MHz ensures the processor remains fed with sufficient data bandwidth to prevent bottlenecking during heavy multitasking or creative rendering tasks.
  • Installing modules with higher frequencies than 3200 MHz results in automatic downclocking to match the system firmware limitations.
  • The 64 GB limit indicates compatibility with high density 32 GB sticks which allows for professional grade virtualization and large dataset processing.
  • Voltage requirements for DDR4 SO-DIMM standards necessitate using 1.2V modules to ensure system stability and thermal efficiency within the thin chassis design.