ACER Aspire A515-45-R6AG RAM upgrade specifications

ACER A515-45-R6AG ACER A515-45-R6AG ACER A515-45-R6AG ACER A515-45-R6AG ACER A515-45-R6AG

The ACER Aspire 5 Series A515-45-R6AG laptop features DDR4-SDRAM memory upgrade specifications. The device contains one SO-DIMM slot compatible with memory modules operating at 2133 MHz frequency. Maximum RAM capacity reaches 24 GB through the upgradeable slot, supplemented by on-board memory. This configuration supports memory expansion for users requiring enhanced multitasking performance and application responsiveness on the A515-45-R6AG model.

Memory Upgrade Specifications

SpecificationValue
Memory slots1x SO-DIMM
Form factorOn-board + SO-DIMM
Memory typeDDR4-SDRAM
Frequency2133 MHz
Maximum RAM24 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2133 (PC4-17064)
Bandwidth17.1 GB/s
Laptop Release date22 July 2021

Additional Notes

  • The ACER Aspire A515-45-R6AG contains soldered memory alongside a single accessible slot, meaning partial rather than complete memory replacement.
  • Total system capacity reaches 24 GB through the combination of onboard memory and the SO-DIMM slot, not through paired modules.
  • The single-slot configuration eliminates dual-channel optimization opportunities, resulting in memory bandwidth limitations for graphics-intensive applications.
  • Memory frequency specification at 2133 MHz indicates PC4-17000 module compatibility, corresponding to approximately 17 GB/s theoretical bandwidth per channel.
  • Asymmetric memory configurations may trigger flex mode operation rather than traditional dual-channel architecture, creating uneven bandwidth allocation across memory segments.
  • The soldered component prevents total memory removal for warranty-safe troubleshooting or complete system memory replacement.
  • Physical installation requires SO-DIMM 260-pin modules specifically, as standard DIMM form factors remain incompatible with the mobile platform.
  • Voltage specifications default to 1.2V for DDR4 standards, making low-voltage or high-performance XMP modules potentially unstable without BIOS-level frequency locking.
  • Single-rank versus dual-rank module selection affects interleaving behavior with the fixed onboard memory, potentially creating latency variations.
  • The 24 GB ceiling suggests an 8 GB soldered component paired with a maximum 16 GB SO-DIMM module for peak configuration.
  • CAS latency timing compatibility depends on matching or exceeding the onboard memory specifications to prevent system downclocking.
  • ECC memory modules lack support in this consumer platform configuration, limiting error-correction capabilities for mission-critical applications.