ACER TravelMate P249-M-342X RAM upgrade specifications
The ACER TravelMate P2 series model P249-M-342X features DDR4-SDRAM memory upgrade specifications. The laptop contains 2x SO-DIMM slots supporting maximum RAM capacity of 32 GB. Memory modules operate at 2133 MHz frequency. Compatible upgrades utilize SO-DIMM form factor memory modules. Specifications define the maximum memory expansion available for the P249-M-342X model within the TravelMate P2 family.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 2133 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-2133 (PC4-17064) |
| Bandwidth | 17.1 GB/s |
| Laptop Release date | 10 August 2017 |
Additional Notes
- Dual-channel memory architecture requires matching modules in both slots to maximize memory bus bandwidth and reduce latency during data-intensive tasks.
- The chipset imposes a physical clock speed ceiling that causes higher-rated modules like 2400 or 2666 MHz to downclock automatically to the 2133 MHz operational limit.
- Physical installation depends on a 260-pin interface which remains incompatible with older DDR3 or DDR3L hardware generations despite similar physical sizes.
- Upgrading to the 32 GB capacity threshold necessitates the use of 16 GB high-density modules per slot which may require a BIOS update to ensure full 64-bit addressing stability.
- Internal access to the SO-DIMM slots typically involves removing a dedicated service hatch or the entire base plate which exposes internal components to electrostatic discharge risks.
- Mixing modules with different CAS latencies forces the integrated memory controller to default to the slowest timing profile present to maintain system boot capability.
- The transition from single-rank to dual-rank memory modules potentially improves interleaving performance but requires verification of memory controller rank support within the specific CPU architecture.
- The absence of soldered onboard memory ensures that the entire system memory remains replaceable in the event of a module failure or for future capacity expansion.