ACER TravelMate TMP215-41-R3QR RAM upgrade specifications

ACER TMP215-41-R3QR ACER TMP215-41-R3QR ACER TMP215-41-R3QR ACER TMP215-41-R3QR ACER TMP215-41-R3QR

The ACER TravelMate P2 TMP215-41-R3QR laptop features DDR4-SDRAM memory upgrades with 2x SO-DIMM slots supporting a maximum RAM capacity of 32 GB total. Memory specifications include DDR4 modules operating at 2133 MHz frequency. The laptop accepts compatible SO-DIMM form factor upgrades, allowing users to expand existing memory configurations up to the maximum specifications. Both memory slots accommodate individual modules for flexible upgrade options.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2133 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2133 (PC4-17064)
Bandwidth17.1 GB/s
Laptop Release date01 February 2021

Additional Notes

  • The 32 GB ceiling reflects chipset limitations rather than physical slot constraints, preventing higher-capacity configurations even when using matching module types.
  • DDR4-2133 represents the JEDEC base specification, meaning modules rated at higher frequencies will downclock to match this maximum supported speed.
  • Dual SO-DIMM architecture enables symmetric memory configurations, which activate dual-channel mode when identical capacity modules occupy both slots.
  • Installing mismatched module capacities forces the system into asymmetric or single-channel operation, reducing theoretical memory bandwidth by approximately 50 percent.
  • The ACER TravelMate TMP215-41-R3QR accepts standard 260-pin SO-DIMM modules, excluding desktop U-DIMM or server registered configurations.
  • Operating voltage typically remains fixed at 1.2V for DDR4 specifications, though some modules advertise XMP profiles that this platform cannot utilize.
  • Warranty preservation generally requires non-destructive installation procedures, as soldered components adjacent to memory slots remain vulnerable during module insertion.
  • Maximum theoretical bandwidth reaches 17 GB/s per channel when both slots operate synchronously at the supported frequency.
  • Thermal headroom considerations become relevant beyond 16 GB total capacity, as higher-density modules generate additional heat within confined chassis spaces.
  • CAS latency variations between CL15 and CL19 modules produce negligible real-world performance differences at this frequency tier.
  • Single-rank versus dual-rank module topology affects compatibility margins, though both types function within the 32 GB maximum threshold.