ASUS ProArt StudioBook W700G1T-AV056R RAM upgrade specifications

ASUS W700G1T-AV056R ASUS W700G1T-AV056R ASUS W700G1T-AV056R ASUS W700G1T-AV056R ASUS W700G1T-AV056R

ASUS ProArt StudioBook Pro 17 W700G1T-AV056R workstation laptop features two SO-DIMM slots for DDR4-SDRAM memory upgrade capability. Maximum supported RAM capacity reaches 64 GB total. Memory specifications include DDR4-SDRAM operating at 2666 MHz frequency. The workstation supports SO-DIMM form factor modules. Upgrade compatibility specifications enable expansion from the factory configuration to the maximum 64 GB capacity through compatible DDR4 memory modules installed in the available slots.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date17 December 2019

Additional Notes

  • The presence of 2 SO-DIMM slots implies that reaching the maximum 64 GB capacity requires the removal of all factory-installed modules to accommodate 2 32 GB sticks.
  • Dual-channel memory architecture is only active when both slots are occupied by matching modules, which significantly impacts integrated graphics performance and memory bandwidth.
  • The 2666 MHz frequency limit suggests that installing higher-rated 3200 MHz modules will result in the hardware automatically downclocking the RAM to match the motherboard bus speed.
  • Hardware stability for the ASUS ProArt StudioBook W700G1T-AV056R depends on utilizing unbuffered non-ECC modules unless the specific processor variant supports Error Correction Code functionality.
  • Physical access to the memory slots involves removing the chassis base plate which may expose internal components to electrostatic discharge risks during the upgrade process.
  • The reliance on DDR4-SDRAM technology prevents the use of newer DDR5 modules due to different physical pin configurations and voltage requirements.
  • Thermal management remains a factor as high-density 32 GB modules generate more localized heat within the compact internal layout during sustained rendering tasks.