ASUS ProArt StudioBook W700G1T-AV059R RAM upgrade specifications

ASUS W700G1T-AV059R ASUS W700G1T-AV059R ASUS W700G1T-AV059R ASUS W700G1T-AV059R ASUS W700G1T-AV059R

ASUS ProArt StudioBook Pro 17 W700G1T-AV059R RAM upgrade specifications include two SO-DIMM slots supporting DDR4-SDRAM memory at 2666 MHz frequency. Maximum compatible RAM capacity reaches 64 GB total. Upgrade requires SO-DIMM form factor modules. Specifications detail compatible memory configurations for enhanced system performance on mobile workstation platform.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency2666 MHz
Maximum RAM64 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-2666 (PC4-21328)
Bandwidth21.3 GB/s
Laptop Release date27 January 2020

Additional Notes

  • The ASUS ProArt StudioBook W700G1T-AV059R imposes a 32 GB per-slot density ceiling, requiring dual-rank modules to reach maximum capacity.
  • DDR4-2666 operation indicates this system uses an Intel 8th or 9th generation mobile platform, which natively supports this speed without overclocking.
  • Higher frequency modules rated at 3200 MHz will automatically downclock to 2666 MHz due to chipset limitations, offering no performance advantage.
  • SO-DIMM form factor requires 260-pin modules specifically designed for mobile platforms, incompatible with standard 288-pin desktop DIMMs.
  • Mixing modules with different densities or speeds across the 2 slots will force both to operate at the lowest common specification.
  • The platform supports unbuffered, non-ECC memory only; registered or error-correcting modules will cause POST failures.
  • Populating both slots enables dual-channel memory architecture, effectively doubling theoretical memory bandwidth to 42.6 GB/s.
  • Accessing the SO-DIMM slots typically requires removing the bottom chassis panel, which may involve Torx T5 or Phillips #0 screws depending on production batch.
  • Operating voltage must remain at standard 1.2V for DDR4-2666; low-voltage or overclocking-spec modules may introduce stability issues.
  • The 64 GB ceiling reflects JEDEC maximum addressable capacity for consumer mobile chipsets in this generation, not a BIOS-imposed restriction.