ASUS ROG G513RM-HQ080W RAM upgrade specifications

ASUS G513RM-HQ080W ASUS G513RM-HQ080W ASUS G513RM-HQ080W ASUS G513RM-HQ080W ASUS G513RM-HQ080W

ASUS ROG Strix G15 G513RM-HQ080W laptop features DDR5-SDRAM memory upgrade specifications with 2x SO-DIMM slots supporting maximum capacity of 32 GB total RAM. Compatible upgrades utilize SO-DIMM form factor modules operating at 4800 MHz frequency. Specifications enable memory expansion for enhanced multitasking performance in gaming and professional applications.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR5-SDRAM
Frequency4800 MHz
Maximum RAM32 GB
Voltage1.1V
Number of pins262-pin
InterfacePC5
PC Speed RatingPC5-4800 (PC5-38400)
Bandwidth38.4 GB/s
Laptop Release date04 May 2023

Additional Notes

  • The DDR5-SDRAM architecture requires module replacement rather than supplementation when upgrading from factory configuration, as mixing different capacity modules often triggers single-channel operation.
  • The 4800 MHz frequency specification represents JEDEC standard baseline timing, while higher-speed modules will downclock to this threshold due to chipset limitations in the ASUS ROG G513RM-HQ080W platform.
  • The 32 GB maximum capacity constraint stems from memory controller addressing limits, making 2x16 GB the only viable configuration for reaching maximum supported capacity.
  • SO-DIMM voltage requirements for DDR5 operate at 1.1V standard, reducing thermal output compared to DDR4 but requiring compatible power delivery circuitry already present in the motherboard design.
  • Dual-channel bandwidth peaks at 76.8 GB/s theoretical maximum when both slots operate synchronously at 4800 MHz, though real-world sustained throughput remains lower due to latency overhead and thermal throttling.
  • Physical access requires bottom panel removal, where the SO-DIMM slots typically sit beneath shielded compartments that void certain regional warranty coverage if tampered with outside authorized service channels.
  • CAS latency specifications become critical at 4800 MHz, where CL40 represents standard timing while tighter CL38 modules may improve frame pacing in GPU-bound scenarios without exceeding platform compatibility.
  • XMP or EXPO profiles embedded in aftermarket modules will remain inactive unless BIOS updates specifically enable user-adjustable memory profiles, which ASUS typically restricts on ROG laptop platforms for stability reasons.
  • The transition from DDR4 SO-DIMM keying means physical incompatibility with previous-generation modules, preventing accidental installation of unsupported memory architectures.
  • Rank configuration affects stability, where dual-rank modules per slot may cause POST failures or force frequency reduction below the 4800 MHz specification when operating at maximum 32 GB capacity.