ASUS ROG G713RM-KH011W RAM upgrade specifications
ASUS ROG Strix G17 model G713RM-KH011W memory upgrade specifications include two SO-DIMM slots supporting DDR5-SDRAM modules. Maximum RAM capacity reaches 32 GB with compatible memory operating at 4800 MHz frequency. Upgrade options utilize SO-DIMM form factor for laptop compatibility. Current specifications detail memory slot configuration and maximum supported capacity for this gaming laptop model.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR5-SDRAM |
| Frequency | 4800 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.1V |
| Number of pins | 262-pin |
| Interface | PC5 |
| PC Speed Rating | PC5-4800 (PC5-38400) |
| Bandwidth | 38.4 GB/s |
| Laptop Release date | 21 January 2022 |
Additional Notes
- The ASUS ROG G713RM-KH011W contains 2 SO-DIMM slots with a combined ceiling of 32 GB, meaning each module can accommodate a maximum of 16 GB per slot to reach the upper limit.
- DDR5-SDRAM at 4800 MHz requires modules explicitly rated for DDR5 specifications; DDR4 components remain physically incompatible due to notch positioning and voltage architecture differences, blocking cross-generation installation.
- Upgrading to DDR5-4800 modules provides narrower bandwidth margins than standard DDR5-5600 or DDR5-6000 configurations, creating potential performance recovery overhead if higher-frequency modules are substituted later within the SO-DIMM DDR5 specification.
- SO-DIMM form factor confinement restricts upgrade sourcing to laptop-grade memory only; desktop UDIMM components cannot physically occupy the available slots regardless of electrical compatibility.
- Installing matched pairs in both slots activates dual-channel memory architecture, doubling bandwidth throughput compared to single-channel configurations and reducing latency during sustained gaming and rendering workloads.
- Memory upgrades on this platform carry no inherent risk to manufacturer warranty provided original modules remain unallocated and installation follows standard electrostatic discharge protocols; adhesive seals on access panels should not be fractured.