ASUS ROG PX713QM-HX288R RAM upgrade specifications

ASUS PX713QM-HX288R ASUS PX713QM-HX288R ASUS PX713QM-HX288R ASUS PX713QM-HX288R ASUS PX713QM-HX288R

The ASUS ROG Strix G17 PX713QM-HX288R supports DDR4-SDRAM memory upgrades with two SO-DIMM slots. Maximum RAM capacity reaches 32 GB total, with compatible modules operating at 3200 MHz frequency. Memory upgrades utilize standard SO-DIMM form factor modules. Specifications define upgrade specifications and compatible memory requirements for this gaming laptop model.

Memory Upgrade Specifications

SpecificationValue
Memory slots2x SO-DIMM
Form factorSO-DIMM
Memory typeDDR4-SDRAM
Frequency3200 MHz
Maximum RAM32 GB
Voltage1.2V
Number of pins260-pin
InterfacePC4
PC Speed RatingPC4-3200 (PC4-25600)
Bandwidth25.6 GB/s
Laptop Release date13 June 2021

Additional Notes

  • The ASUS ROG PX713QM-HX288R architecture imposes a 32 GB ceiling due to chipset limitations, preventing future expansion beyond 2x16 GB modules regardless of higher-density module availability.
  • The dual-channel SO-DIMM configuration requires matched pairs to maintain optimal memory interleaving, as mismatched capacities or timings force the controller into asymmetric or single-channel operation.
  • DDR4-3200 represents the maximum JEDEC-standard speed supported without entering overclocked XMP territory, which typically voids manufacturer warranties on mobile platforms.
  • The SO-DIMM form factor restricts compatibility to laptop-specific modules measuring 67.6mm in length, eliminating standard desktop DIMM options that measure 133.35mm.
  • Memory bandwidth peaks at 51.2 GB/s in dual-channel mode, creating potential throughput constraints for GPU-intensive workloads that share system memory resources.
  • Module height tolerances below 30mm prevent interference with thermal solutions, though low-profile heat spreaders remain unnecessary given the enclosed cooling design.
  • Mixing DDR4 generations with different voltage requirements (1.2V standard versus 1.35V legacy) forces the memory controller to default to the higher voltage across all slots.
  • CAS latency variations between installed modules cause the system to synchronize at the slowest common timing, degrading effective latency even when one module supports tighter specifications.
  • Operating frequencies above 3200 MHz require manual BIOS intervention and may introduce stability issues under sustained thermal loads typical of mobile workstation usage patterns.
  • The 260-pin SO-DIMM interface provides physical keying that prevents DDR3 or DDR5 insertion, though visually similar modules require verification before purchase.