ASUS ROG PX713QM-HX288R RAM upgrade specifications
The ASUS ROG Strix G17 PX713QM-HX288R supports DDR4-SDRAM memory upgrades with two SO-DIMM slots. Maximum RAM capacity reaches 32 GB total, with compatible modules operating at 3200 MHz frequency. Memory upgrades utilize standard SO-DIMM form factor modules. Specifications define upgrade specifications and compatible memory requirements for this gaming laptop model.
Memory Upgrade Specifications
| Specification | Value |
|---|---|
| Memory slots | 2x SO-DIMM |
| Form factor | SO-DIMM |
| Memory type | DDR4-SDRAM |
| Frequency | 3200 MHz |
| Maximum RAM | 32 GB |
| Voltage | 1.2V |
| Number of pins | 260-pin |
| Interface | PC4 |
| PC Speed Rating | PC4-3200 (PC4-25600) |
| Bandwidth | 25.6 GB/s |
| Laptop Release date | 13 June 2021 |
Additional Notes
- The ASUS ROG PX713QM-HX288R architecture imposes a 32 GB ceiling due to chipset limitations, preventing future expansion beyond 2x16 GB modules regardless of higher-density module availability.
- The dual-channel SO-DIMM configuration requires matched pairs to maintain optimal memory interleaving, as mismatched capacities or timings force the controller into asymmetric or single-channel operation.
- DDR4-3200 represents the maximum JEDEC-standard speed supported without entering overclocked XMP territory, which typically voids manufacturer warranties on mobile platforms.
- The SO-DIMM form factor restricts compatibility to laptop-specific modules measuring 67.6mm in length, eliminating standard desktop DIMM options that measure 133.35mm.
- Memory bandwidth peaks at 51.2 GB/s in dual-channel mode, creating potential throughput constraints for GPU-intensive workloads that share system memory resources.
- Module height tolerances below 30mm prevent interference with thermal solutions, though low-profile heat spreaders remain unnecessary given the enclosed cooling design.
- Mixing DDR4 generations with different voltage requirements (1.2V standard versus 1.35V legacy) forces the memory controller to default to the higher voltage across all slots.
- CAS latency variations between installed modules cause the system to synchronize at the slowest common timing, degrading effective latency even when one module supports tighter specifications.
- Operating frequencies above 3200 MHz require manual BIOS intervention and may introduce stability issues under sustained thermal loads typical of mobile workstation usage patterns.
- The 260-pin SO-DIMM interface provides physical keying that prevents DDR3 or DDR5 insertion, though visually similar modules require verification before purchase.